详细介绍

离子束抛光系统

仪器简介：

ATC 1800-IM 型

The system shown above is equipped with a gridded ion source positioned for uniform milling of a 200mm diameter substrate. System features a 1200 l/s turbopump, load-lock with 6-position cassette, and substrate holder with backside gas cooling and rotation. Etch rate is 320 A/min of SiO2 with +/- 2% uniformity.

离子束抛光系统

ATC ORION-IM 型

The system shown above is equipped with an ICP RF plasma source with ion energies up to 300 eV for low energy milling of substrates up to 150mm in diameter. System also includes a 700 l/s turbopump and substrate holder with simultaneous water cooling, rotation, and 0-80 degree tilting capability.

应用：自旋阀 /AMR/ GMR
磁隧道结
介电界面涂层
Rugate Filters
High-k 材料
形状记忆合金
光电材料
超导材料
单一结晶GaN

主要特点：
高效高产量，低能量等离子体源
6 x 4" 偏置靶材旋转架
独立偏置靶材，专业用于控制沉积合金复合材料
100mm 直径样品表面处理
<3%>衬底样品表面等离子体清洗，刻蚀氧化，氮化
水冷，旋转，磁化，挡板样品台，加热至 600 C
单片样品传输台（load lock stage）

产品简介

详细介绍

ATC 1800-IM 型

ATC ORION-IM 型

The system shown above is equipped with an ICP RF plasma source with ion energies up to 300 eV for low energy milling of substrates up to 150mm in diameter. System also includes a 700 l/s turbopump and substrate holder with simultaneous water cooling, rotation, and 0-80 degree tilting capability.